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Headquartered in Santa Clara, CA, Multibeam Systems,
Inc. is headed by David Lam, CEO, and N. William Parker,
CTO.
As the leader in
multi-column e-beam technology, Multibeam holds a
substantial IP portfolio. Multibeam’s e-beam column, the
MBX<TM> Engine, is capable of extraordinary writing
speeds, making it a cost-effective solution to the
lithography challenges facing the semiconductor
industry.
In
addition to developing custom e-beam columns for OEMs,
Multibeam develops complete multi-column e-beam
lithography systems.
Multibeam Team
Multibeam has assembled a world-class engineering team
to develop our electron beam system. Multibeam's
management team has a track record of success in leading
the development and production of semiconductor
manufacturing equipment.
-
David Lam -
CEO
-
N. William Parker -
CTO
Find out more about
our executives.
E-Beam History
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1935: First Scanning Electron Microscope (SEM) image
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1970s to 1980s:
E-beam Direct Write (EBDW) used to produce ICs for
use in mainframe computers.
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1980s to today:
E-beam mask writers are used to pattern photomasks.
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1999:
Scalpel (ASML, Applied Materials, Lucent).
Multibeam Milestones
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2004-2006:
NIST sponsored EBDW project at Multibeam
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2007-2008:
Multibeam develops high volume e-beam column with
OEM customer.
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Apr 2008:
David Lam becomes CEO
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Jan 2009: Multibeam moves to new headquarters
Technology
Multibeam has developed unique
beam-shaping technologies to achieve high current density at the wafer. Additionally, our
e-beam columns are all-electrostatic, enabling small column footprint
and fast slew rates. Each e-beam column has its own Schottky thermal emitter source and is independently
controlled and functioning, acting as an individual e-beam lithography
system.
By combining multiple
e-beam columns into an array, our MBX Engines are
capable of achieving speeds that are orders of magnitude
higher than single beam systems. |
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